陈超，博士，副教授，硕士生导师

办公地点：材料学院2024

邮箱：chenchao@hubu.edu.cn

个人简介：2008年毕业于永利集团官网首页，材料化学学士学位; 2016年毕业于华中科技大学，材料物理与化学博士学位。研究兴趣是聚合物复合材料加工过程中的物理和化学结构变化，通过新填料开发和加工新方法设计，制备先进聚合物基导热复合材料。目前以第一/共同第一作者在国际重要学术期刊发表论文10余篇, 授权中国专利8项。承担国家自然科学基金1项，参与国家自然科学基金重大国际合作项目1项。

Dr. Chao Chen is an Associate Professor in Materials Science and Engineering at Hubei University. He obtained his B.S. degree from Hubei University in 2008 and his Ph.D. degree from Huazhong University of Science and Technology in 2016. His research interest involves the physical and chemical structure changes during processing of polymer composites, developing new fillers and new processing methods for advanced polymer-based thermally conductive composites. He has published more than 10 papers in international academic journals as the first/co-first author, and has authorized 8 Chinese patents. He has led the National Natural Science Foundation Youth Fund Program (2019~2021) and participated in the International Cooperation and Exchange of the National Natural Science Foundation (2013~2017).

Major Journal Articles:

1．Jinbao Song, Kailun Zhang, Zihao Guo, Tianqi Liang, Chao Chen, Jie Liu, Dean Shi, h-BN orientation degree on the thermal conductivity anisotropy of their silicone rubber composites: A quantitative study, Compos. Part A-Appl. S., 2023, 166(107389):107389.

2. Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, Dean Shi, Guo-Hua Hu, Xiaolin Xie, Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability, Compos. Sci. Technol., 2021, 209: 108760.

3. Chao Chen, Yang Xue, Xiongwei Li, Yingfeng Wen, Jinwei Liu, Zhigang Xue, Dean Shi, Xingping Zhou, Xiaolin Xie, Yiu-Wing Mai, High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging, Compos. Part A-Appl. S., 2019, 118: 67-74

4．Chao Chen, Yang Xue, Zhi Li, Yingfeng Wen, Xiongwei Li, Fan Wu, Xiaojing Li, Dean Shi, Zhigang Xue, Xiaolin Xie, Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles, Chem. Eng. J., 2019, 369: 1150-1160.

5. Chao Chen, Yongjun Tang, Yun-Sheng Ye, Zhigang Xue, Yang Xue, Xiaolin Xie, Yiu-Wing Mai, High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging, Compos. Sci. Technol., 2014, 105: 80-85